SHINKO ELECTRIC INDUSTRIES CO.,LTD.
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Packaging / Module assembly

Module assembly

Concept

  • Small high performance module with great variety of assembly technology

Features

  • Total support from design, and assembly through testing
  • Various chip connection technology (wire bonding, flipchip and chip stack) and small package assembly technology(WLP)
  • High density mount technology of small passive component and connector
  • Module design availability for radio frequency
  • All parts including passive components can be sealed into one mold which is able to be handled as a typical semiconductor package.

Structure

Camera module assembly

Uses

  • Cell phone , digital still camera , super small and high density products

Assembly support range

  • Wafer , bare die handling
  • Variable connection technology such as wire bonding, flipchip, chip stack
  • Small passive component mount such as 0603(0.6x0.3mm)

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