Optical Chiplet/Co-Packaged Optics
(under development)

Introduction

In the modern society of digitalization, the amount of information data processing is increasing, and reducing power consumption at data centers has become challenges. Today, various research and development have been ongoing to implement optical technology to suite large capacity, low latency, and low power consumption. As one of the solutions, optoelectronic convergence technology (which combines electrical circuit and optical circuits) is attracting attention.

For the realization of optoelectronic convergence, SHINKO is developing optical assembly and optical wiring technologies in addition to our core technologies of semiconductor packaging substrates and IC assembly.

Features

• Small, optical chiplet* assembly with highly efficient optical connection between optical devices and Fiber Array
• Co-Packaged Optics (CPO) assembly with optical chiplet and optical communication between xPU (CPU, GPU, etc.) packages

* Optical chiplet : An optoelectronic device that integrates a photonic integrated circuit (PIC) and an electronic integrated circuit (EIC) used in high-density packaging technology.

Structure

• CPO example

* i-THOP (integrated Thin film High-density Organic Package). i-THOP is a registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.

• Optical chiplet

Applications

• High-end server
• Data communication and networking equipment

Technical Document (Download)

Click on download the PDF file and view details.