2.3D Package Substrate ~i-THOP®~
(under development)

*i-THOP (integrated Thin film High density Organic Package).
i-THOP is a registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.

Introduction

Due to increasing demands of chiplets, and logic and Wide Bandwdith Memory interface on semiconductor package designs such as advanced CPU and GPU, therefore 2.5D structures using Silicon interposers have become mainstream.

SHINKO has developed ultra-high-density organic substrate, “i-THOP®”, as the alternative solution of 2.5D packages.

Features

• Ultra-high-density substrate integrating an organic interposer and a build-up substrate, which enables “chip-last” assembly process order
• Ultra fine pitch for line & space, numerous I/O terminals enabled on the interposer applying thin film technology
• Flexible to enlarge the package to accommodate multiple features such as heterogeneous chip integration, mounting Wide Bandwidth memory chips such as HBM, and/or chiplets

Structure

Design

Target Areas & Status

Technical Document (Download)

Click on download the PDF file and view details.