Introduction
Leadframes for exposed pad packages are used to achieve high heat dissipation by exposing the back side of a die pad on a molded package.
SHINKO provides leadframes which are possible wire bonding between power ground pads and the die-pad for stable power supply.
Features
- High heat dissipation
- SHINKO's unique deep metal bending technology realizes the stable level difference control and flatness
- Available for bending, half cutting and half etching at the edge of die-pad
- Various surface finish, Ag plating, Pd plating and Micro rough surface, are supposed
Structure
Applications
- Logic and power devices requiring high heat dissipation
- Various devices requiring stable power supply
- Sensor, etc.
