IC chips are rapidly evolving. In order to maximize their performance, SHINKO provides substrates that have a variety of features for semiconductor packages.
Widely used leadframe packages. SHINKO is manufacturing various types of leadframes by using ultra-precision stamping or chemical etching.
IC assembly for mounting IC chips in package, SHINKO is developing various interconnect technologies for supporting semiconductor packages from single-chip packaging to module assembly.
Glass-to-Metal Seals made of metal and glass. SHINKO’s Glass-to-Metal Seals products are characterized by high hermeticity and superior electrical characteristics, and are widely used in products requiring high reliability, such as semiconductor laser and automotive device, etc.