Device Embedded Package ~MCeP®~

*MCeP (Molded Core embedded Package) is a patented, registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.

Introduction

MCeP® is a semiconductor package that contains IC chips and active/passive components, and one of Molded Embedded Package (MEP).
MCeP® is a compact and thin package developed by SHINKO’s unique semiconductor packaging technology. This package, having superior electrical characteristics and high reliability, is used in small-sized electronic devices and various modules.

Features

• Assembles IC chips and active/passive components with conventional assembly processes
• Robust semiconductor package structure achieving low warpage while combining small size and low profile
• Flip chip connectivity that supports fine pad pitch
• High design flexibility on package surface
• High assembly yield and high reliability backed by a wealth of mass production achievements

Structure

Standard MCeP®

MCeP® Options (under development)

• AiP/AoP (Antenna in Package/Antenna on Package)
  • Single compact package containing both high-frequency (RF) chip and antenna

• Modules
  • Compact module containing multiple IC chips and components. Another device can be mounted on the surface of this package

• PoP (Package on Package)
  • Multi-purpose packages or modules such as memory can be mounted on the top of MCeP®

• Multi-Chip Package

• Enhanced thermal performance modules
  
  • Structure with improved thermal dissipation transfers heat through leadframe to PCB (Printed Circuit Board)

Applications

• Application processors for mobile devices
• Application processors for AR/VR
• Image processors
• Application processors for drones
• IoT products (smartwatches, etc.)
• Antenna packages
• Sensor packages
• Memory controllers for SSD
• Driver status monitors for automobiles

Technical Document (Download)

Click on download the PDF file and view details.