Substrate

Plastic BGA Substrate

Introduction

SHINKO supplies organic substrates using prepreg for BGA packages for logic, memory, and sensor devices. 2 layers or 4 layers through-hole substrates are used for devices such as automotive application requiring high reliability. Build-up substrates that can use multi-layer structure are used for semi-conductor packages that require size reduction and high density.

Features

2 Layers/ 4 Layers Through Hole Substrate

  • Substrate with low cost and high reliability
  • Superior electrical characteristics
  • Etch back process is supported

Build-up substrate (IVH* substrate)

  • Superior electrical characteristics
  • High density is possible by using semi-additive process and laser vias
  • Multilayer structure consisting of 4 or more layers is possible
  • Structure of via on PTH (Plated Through Hole) and structure of stacked via are supported
  • Thinner substrate thickness is available by using thin core
  • Etch back process is supported
  • Available for both WB (Wire Bonding) and FC (Flip-Chip)

*IVH: Interstitial Via Hole

Structure

bga_substrate.png

bga_substrate_ivh.png

Applications

  • Chip sets
  • Controllers
  • Memory
  • ASIC
  • Image sensors
  • Devices such as automotive requiring high reliability

Technical Document (Download)

Substrate

substrate_EN.jpg

PBGA Substrate

pbga_EN.jpg

Click on download the PDF file and view details.