
Introduction
SHINKO provides a high-heat-dissipation flip-chip package that radiates heat to a heat spreader (lid) from the back side of an IC chip through the TIM (Thermal Interface Material).
Features
- With the back side of the chip exposed from the mold resin, heat generated from the IC chip is dissipated directly to the lid
- High quality and low price are realized by adopting an in-house leadframe as the lid
- Various types of flip-chip bonding technology with high density IC chips are available
- A molded exposed die structure under the lid enables low package warpage with a thin substrate.
- 4 to 6 layers substrates with 200 μm thickness core suitable for this package
- Has been applied up to AEC-Q100 grade 2 capable automotive devices
Structure


Options (under development)

Applications
- Application processors for car navigation
- Application processors for drones
- Image processors
- IC packages for SSD controllers
- Processors for servers
- LSI packages requiring high-heat dissipation
Technical Document (Download)

Click on download the PDF file and view details.