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IC Assemblies

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Components

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Under Development

arrow POL(Power Overlay)
arrow Micro Loop Heat Pipe [M3HP]
arrow Wireless Sensor Module
arrow i-THOP®
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Feature of R&D

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Advanced Technologies

arrow Multi-layer Thin Film Technology
arrow Fine Pitch Solder Joint Technology
arrow Low Temperature Solder Bonding

Core Technologies

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arrow Cu Trace Formation Technology by SAP using Dry Process
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Related Information

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