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arrow P-BGA Substrate
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IC Assemblies

arrow Device Embedded Package [MCeP®]
arrow High Heat Dissipation and High Density Flip Chip Package
arrow Module Assembly
arrow PoP(Package on Package)
arrow Cu Pillar
arrow Test Service

Components

arrow Ceramic Electro Static Chucks
arrow Heat Spreader
arrow Glass-to-Metal Seals

Under Development

arrow POL(Power Overlay)
arrow Micro Loop Heat Pipe [M3HP]
arrow Wireless Sensor Module
arrow i-THOP®
arrow Optical Waveguide Substrate
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Feature of R&D

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Advanced Technologies

arrow Multi-layer Thin Film Technology
arrow Fine Pitch Solder Joint Technology
arrow Low Temperature Solder Bonding

Core Technologies

arrow Product Technology Matrices
arrow Cu Trace Formation Technology by SAP using Dry Process
arrow New Electrolytic Cu Plating Technology
arrow Surface Finishing Technology

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Related Information

arrow Quality Policy
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2016