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Procurement
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Application

Computing & Networking Mobile Industrial & IoT Automotive

Computing & Networking

Semiconductor Package

icon Substrate

Flip-Chip Package Substrate PBGA Thin Substrate (Coreless) 2.3D Package Substrate Substrate w/Opt.-wiring

icon IC Assembly

Device Embedded Package (MEP) Bare Die Flip-Chip Package Molded Underfill FC Package Lidded FC Package Optical Chiplet/CPO

icon Glass-to-Metal Seals (GTMS)

GTMS for LD Device CAN PKG for Opt. Communication

Thermal Management Parts

Heat Spreader CNT-TIM

Related technology

Dry Cu Wiring Technology Assembly Tech. for Next Gen. Simulation/Measurement Fine Pitch FC Bump Tech.

Mobile

Semiconductor Package

icon Substrate

Flip-Chip Package Substrate PBGA Thin Substrate (Coreless)

icon Leadframe

Non-Lead Package Leadframe

icon IC Assembly

Device Embedded Package (MEP) Bare Die Flip-Chip Package Molded Underfill FC Package Copper Pillar Bumping

Thermal Management Parts

CNT-TIM

Related technology

Simulation/Measurement Fine Pitch FC Bump Tech.

Industrial & IoT

Semiconductor Package

icon Substrate

PBGA Substrate

icon Leadframe

Non-Lead Package Leadframe Leaded Package Leadframe Exposed Pad Leadframe

icon IC Assembly

Device Embedded Package (MEP) Lidded FC Package Power Device Package Sensing Edge Device

Thermal Management Parts

CNT-TIM

Product for Semiconductor Manufacturing Equipment

Ceramic Electrostatic Chuck

Metal Products

Motor Core Precision Die Parts

Automotive

Semiconductor Package

icon Substrate

PBGA Substrate

icon Leadframe

Non-Lead Package Leadframe Leaded Package Leadframe Exposed Pad Leadframe Riveting Leadframe

icon IC Assembly

Device Embedded Package (MEP) Lidded FC Package Power Device Package Sensing Edge Device

icon Glass-to-Metal Seals (GTMS)

GTMS for LD Light Source GTMS for Initiator

Thermal Management Parts

Heat Spreader CNT-TIM

Metal Products

Motor Core