Introduction
Riveting leadframes are the two-layered leadframe stacking a non-die-pad leadframe and a heat slug by riveting technology.
SHINKO recommends riveting leadframes for semiconductor packages requiring high heat dissipation.
Features
- A high heat dissipating package that is designed the heat slug is attached to the single-layered leadframe by riveting and the heat slug is exposed outside the package
- In combination with our surface finish technologies for high adhesiveness to mold resin, it is applicable for high reliability required products such as automotive application
Structure
- The heat slug thickness is designed to expose the back side surface of the heat slug from package surface.
Application
- Various ECUs for automotive and other devices requiring high reliability
