Introduction
A bare die flip-chip package is a semiconductor package in which an IC chip is flip-chip mounted on an organic substrate and the interconnect area is filled with underfill resin.
Stacked package structure like a PoP (Package on Package) can be formed by mounting IC chips.
Features
- Enables overall package height reduction by allowing flip-chip mounting of an IC chip thickness 70 μm thick or less.
- IC pad pitch connection less than 45μm is available
- Turnkey processes for IC assembly and electrical test are available
Structure
Applications
- Application processors for mobile devices
- Image processors for digital still/video cameras and security cameras
- Packages (antennas) for high-speed communication application
- Stacked package structure
