IC Assembly

Bare Die Flip-Chip Package


A bare die flip-chip package is a semiconductor package in which an IC chip is flip-chip mounted on an organic substrate and the interconnect area is filled with underfill resin.
Stacked package structure like a PoP (Package on Package) can be formed by mounting IC chips.


  • Enables overall package height reduction by allowing flip-chip mounting of an IC chip thickness 70 μm thick or less.
  • IC pad pitch connection less than 45μm is available
  • Turnkey processes for IC assembly and electrical test are available




  • Application processors for mobile devices
  • Image processors for digital still/video cameras and security cameras
  • Packages (antennas) for high-speed communication application
  • Stacked package structure