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2026

2026.05.22

SHINKO to Exhibit at the 2026 IEEE 76th Electronic Components and Technology Conference（ECTC2026）

2026.04.24

Updated Sustainability

2026.04.24

Newly launched MVV(Mission, Vision, and Values)

2026.03.13

SHINKO to Exhibit and Speech at 2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)

2026.03.09

SHINKO to Speech at 2026 Touch Taiwan

2026.02.27

SHINKO to Speech at 68th IEEE EPS Japan Chapter Evening Meeting

2026.02.16

SHINKO to Exhibit at the 22nd Device Packaging Conference 2026 (DPC2026)

2026.01.30

Updated Sustainability