Introduction
To realize next-generation photonics convergence, SHINKO is developing a multilayer, high-density substrate with optical waveguides for high-speed transmission and high-capacity communication based on our advanced semiconductor package substrate technology.
Features
- Multi-channel optical interface for high-speed transmission and high-capacity communication between chips
- Applied polymer optical waveguides capable of single mode transmission
- Wiring optical waveguides on Flip-Chip BGA (FC-BGA) substrate directly for Co- Packaged Optics (CPO)
Structure
- Example of using FC-BGA substrate with optical waveguides
＊PIC：Photonic Integrated Circuit
Applications
- High-end server
- Data communication and networking equipment
Technical Document (Download)
Substrate with Optical Waveguides
Optical Chiplet/Co-Packaged Optics
Click on download the PDF file and view details.
