Substrate with Optical Waveguides
(under development)

Introduction

To realize next-generation photonics convergence, SHINKO is developing a multilayer, high-density substrate with optical waveguides for high-speed transmission and high-capacity communication based on our advanced semiconductor package substrate technology.

Features

• Multi-channel optical interface for high-speed transmission and high-capacity communication between chips
• Applied polymer optical waveguides capable of single mode transmission
• Wiring optical waveguides on Flip-Chip BGA (FC-BGA) substrate directly for Co- Packaged Optics (CPO)

Structure

• Example of using FC-BGA substrate with optical waveguides

^＊PIC：Photonic Integrated Circuit

Applications

• High-end server
• Data communication and networking equipment

Technical Document (Download)

Click on download the PDF file and view details.