Leadframe

Non-Lead Package (QFN) Leadframe

Introduction

To meet the needs for package size reduction, there is an increasing demand for leadless packages, which have exposed external leads on the back side. SHINKO supplies customers' requested leadframes by using etching technology and plating/surface finish technologies.

Features

  • Package mounting area can be reduced by approximately 40% (for SSOP 16/24 pins)
  • The fine ring-load design with stable depth at the bottom side of leadframe by the etching
  • Mold tape lamination for Map-type leadframe is supposed
  • Pd plating for Lead free process is supported
  • High accuracy spot Ag plating by using photolithography technology
  • Micro rough surface for highly reliable packages

Structure

ワイヤーボンディングタイプ.png

フリップチップタイプ.png

Dual-Row(DR)-QFN.png

Applications

  • Power device (e.g., converter, regulator, power amplifier)
  • Logic
  • Sensor, etc.

Technical Document (Download)

leadframe_EN.jpg

Click on download the PDF file and view details.