Introducing SHINKO’s research and development into the unique advanced technologies that are leading the industry.> Learn more
Introduction of advanced technology developments in SHINKO R&D for supporting our products.
SHINKO is developing fine patterning and high integration technology for substrates for semiconductor package.
SHINKO is developing interconnect technologies for fine-pitch IC Chips.
The plating technology is widely used in our products. SHINKO is continually evolving this technology.