SHINKO ELECTRIC INDUSTRIES CO., LTD.
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To Our Shareholders
Leadframe
SHINKO provides the Pre-Plated leadframe for reduction of lead-time by eliminating external solder plating process in IC assembly.
SHINKO’s Pre-Plated leadframe is three-layers, Nickel-Palladium-Gold (Ni/Pd/Au), plating on entire leadframe surfaces for providing good interconnection between the IC chip and inner-leads of the leadframe, also outer-leads of the leadframe and Printed Circuit Board (PCB). In addition, stable package reliability is ensured.