Introduction
SHINKO supplies coreless substrates which are thin build-up substrates made by removing a core layer for memory or others use in sophisticated small electronic devices such as smartphones.
Features
- Ultimate substrate thickness reduction is possible
- Superior electrical characteristics
- Available for both WB (Wire Bonding) and FC (Flip-Chip)
- Multilayer structure consisting of 3 or more layers is possible
- High density is possible by using semi-additive process and laser vias
- Etch back process is supported
Structure
Applications
- Memory
- Logic
- RF devices, etc.
Technical Document (Download)
Substrate
PBGA Substrate
Click on download the PDF file and view details.
