IC Packages/IC Lead Frames
By a clicking on the Shinko logo icons around the town,
you can see what kind of products we provide and how
those products support people’s lives.
Flip-chip type packages for CPUs, which function as the “brains” of computers, heat spreaders that dissipate a CPU’s heat, lead frames for hard disk drives for data storage, and glass-to-metal seals for laser diodes used in DVD drives; these are only some of our products that fully employ our cutting-edge technologies.
We carry out the assembly of high-performance ICs for high-end smartphone use. Furthermore, plastic-BGA substrates see use in memory with increasing capacity (mobile DRAM, flash memory), and lead frames are used within a variety of ICs installed in smartphones. Both of these aid in the creation of smaller, lighter smartphones that maintain a high level of functionality.
Many of our products are utilized in tablets, the use of which is expanding in the classroom, at business meetings, and elsewhere. Our plastic-BGA substrates are used in memory (mobile DRAM, flash memory), and many of our lead frames are used in a variety of ICs that support a tablet’s functions.
A variety of our products are used in automobiles, in which technology development is accelerating, including self-driving and electric vehicles. Our plastic-BGA substrates are used in electronic control units (ECU) for engines and information systems, and we can also be found in ICs used to control car navigation system, information communication services, and other infotainment systems. We also perform IC assembly for infotainment. Our highly reliable glass-to-metal seals are used for a variety of sensors critical to ensuring safety and comfort. Our lead frames have a variety of applications, such as ECU and power ICs.
Semiconductor Manufacturing Equipment
Our ceramic electro static chucks are used in semiconductor manufacturing equipment (dry etching equipment) that form fine circuits on silicon wafers. Electro static chucks that affix wafers via static electricity require a high degree of durability and heat uniformity. We perform integrated manufacturing from ceramic blending to production and assembly in order to meet the needs of the market.
We provide high-precision, high-quality motor cores which are the main parts of motors through the application of high-precision die technology we have created. The design and production of dies takes place in-house, and our high-precision die technology enables us to stamp into fine, complex shapes.
For data center servers that handle and process large amounts of data transmitted on a network, our flip-chip type packages are used in their CPUs, which function as the “brains” of servers, as well as our heat spreaders that efficiently disperse the heat generated from the CPU, and our lead frames are used in their hard disk drives. We anticipate an even greater volume of demand for high-performance CPUs installed on servers in the future.
Our highly reliable glass-to-metal seals are used in communication base stations. Glass-to-metal seals are packages made of both metal and glass characterized by high hermeticity and excellent electrical characteristics that support communication infrastructure. Additionally, our flip-chip type packages are used in CPUs that quickly process a large volume of data that gather at communication base stations.
From large-size projectors situated in wide-open halls to small-size projectors fit for a tabletop, our glass-to-metal seals are used in laser diodes that serve as light sources of the projectors. Projectors using laser diodes as their light source offer advantages such as lower power consumption, higher brightness, and a longer lifespan. Our products are leveraged in this field, too.
We assemble digital camera ICs known as imaging engines, and our small, thin plastic-BGA substrates are used in flash memory that stores pictures and other data.
Our products even appear in consumer gaming consoles. Our flip-chip type packages are used in their high-performance CPUs that rival the performance of CPUs for PCs, and our glass-to-metal seals are used for laser diodes in their Blu-ray Disc drives.
Our lead frames see use in a variety of ICs installed in televisions. Lead frames are highly versatile, seeing use not only in televisions but also in ICs used in home electronics such as refrigerators and washing machines.
Be it delivering goods, taking photos, or spraying pesticide from the skies above, our lead frames also see use in drones with ever-evolving roles. They are responsible for the communications in the drone itself as well as its control apparatus.
Demand is on the rise for power modules that combine multiple power semiconductors as core components in power electronics for power control units that govern the power supply. We are currently tackling the issue of bringing highly reliable substrates for power modules to market based on our cultivated die, stamping, and plating technologies.
We are continuing development of a module product for the medical field based on our assembly technology. A single module integrates a sensor, CPU, an RF-IC that process high-frequency signals, and an antenna. It is possible to transfer real-time physical data gained from built-in sensors to a PC or a smartphone.