Leaded Package (QFP/TSOP) Leadframe

Introduction

Leaded package of which outer leads on the side of the package can function as external terminals. SHINKO''s Leadframes using high precision stamping and etching technologies, also surface finish technologies, have been used in various applications such as automotive devices requiring high reliability.

Features

• Micro rough surface for highly reliable packages
• Wide frame design appropriate for matrix leadframes
• Fine pitch design using in-house precision stamping die tools
• High accuracy metal bending process

Structure

Applications

• Various ECUs for automotive requiring high reliability
• Logic
• Memory
• Sensor, etc.

Technical Document (Download)

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