SHINKO ELECTRIC INDUSTRIES CO.,LTD.
Products & Services

IC Package / Leadframe

Enhanced thermal performance Leadframe

Riveting Leadframe

Features

  • A high-heat-dissipating package where the heat slug is attached to the single-layered leadframe by riveting, and the heat slug is designed so that it is exposed outside the package.
  • In combination of plating with high adhesiveness to the mold plastic, it is employed in high reliability package for cars.

Structure

  • A two-layered leadframe having a connecting point for the leadframe without a die pad and a heat slug is attached to the leadframe at the riveting portion.
  • The thickness of the heat slug is designed so as to expose it on the package after the mold has been formed.
riveting pic
riveting pic

Process

riveting process

DPH QFP (Die Pad Heat Spreader QFP)

Features

  • A high-thermal-dissipation package with a heat spreader attached by adhesive tape to the leadframe
  • The leadframe can be made of a strong copper alloy, while the heat spreader can be made of an alloy with good thermal conduction properties, making it possible to have different materials in the same package

Structure

  • A high-thermal-dissipation package with a heat spreader attached by adhesive tape to the leadframe
DPH
DPH

E-DPH QFP (Exposed Die Pad Heat Sink QFP)

Features

  • A high-heat-dissipating package where the heat sink is attached to the single-layered leadframe by tape, and the heat sink is designed so that it is exposed outside the package

Structure

  • A two-layered leadframe in which the heat sink is attached to the lower surface of a die pad-less leadframe with double-sided adhesive tape
  • The thickness of the heat sink is designed so as to expose it on the package after the mold has been formed
EDPH 1
EDPH 2
EDPH Structure

Exposed Pad Leadframe

Features

  • Leadframe which realized superior thermal dissipation by exposing the bottom surface of the die pad
  • Original technology of deep bending realizes the stable level difference control and flatness
  • We are available for bending, half cut, half etching of the die pad end face
  • Various plating (Ag / Pd-P.P.F / Micro rough surface)

Structure

EXP

Technology of deep bending

EXP deep bending
EXP deep bending

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