IC Packages/IC Lead Frames

Lead Frame

SHINKO is developing and manufacturing a variety of lead frames, such as stamping lead frames with 256 pins; Enhanced thermal performance lead frames with superior heat-dissipation properties; and Plastic Very Thin Quad Flat Non-leaded(P-VQFN).
We are also developing super fine-pitch, matrix, and deep downset lead frames.
SHINKO strives to improve package development and manufacturing from many perspectives. For example, we are promoting the use of a lead-free palladium plating process, which will contribute toward protecting the global environment.

Product name Concept

>SFP-LF
(Super Fine Pitch Stamped Lead Frame)

By placing an inner lead close to the IC chip made possible for stabilized production of IC packaging and a significant cost reduction.
>Enhanced Thermal Performance Lead Frame An efficient heat-diffuser particularly suited for devices that require superior thermal dissipation
>P-VQFN
(Plastic Very Thin Quad Flat Non-leaded)
A CSP built applying lead frame processing technology
>Pd-P.P.F
(Palladium Pre Plated Lead Frame)
Higher functional characteristics is achieved by palladium plating in addition to nickel-plating on the lead frame.

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