IC Assemblies

Module Assembly

Module Assembly

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High-density modules are a solution to the demands of mobile devices which require higher speeds, multi-functionality and miniaturization.
We provide comprehensive support from design to assembly including test, to realize customer requirements. Characteristics requirements for products such as GPS and RF modules are also available to provide.

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[Example:reader/writer module for RFID application]

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[Example:GPS down converter Module]

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[Example:ZigBee compliant wireless module]

Concept

  • Small and high performance module with a great variety of assembly technology

Features

  • Integrated support system from design to assembly including testing
  • Compatible with bare-chip mounting using wire and flip-chip technology, as well as mounting of small and odd-shaped components such as various chip components and connectors
  • Design support for high frequency radiation
  • Can be handled like a general semiconductor package by using mold encapsulation technology

Structure

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Application

  • Automotive
  • Industrial   and so on

Related Information