Simulation and Measurement Technology

Introduction

SHINKO utilizes simulation technology in such diverse areas as development, design, reliability evaluation, and process development for semiconductor package substrate. SHINKO suggests optimal solutions that meet customers’ demands by simulating various physical phenomena indispensable for high-performance semiconductor package substrate development from development of high-speed transmission-line signal quality to implementation reliability such as thermal characteristics, thermal stress, and warpage.

Features

Thermal & Mechanical Simulation and Measurement

Stable manufacturing and reliability improvement of products by thermal/mechanical simulation and measurement technologies

• Thermal resistance simulation/measurement technology for developing enhanced thermal performance packages
• Stress simulation technology in all implementation areas of the warpage of semiconductor package substrate, stress and strain in joints, etc.

Electrical Simulation and Measurement

Design support by both simulation and measurement to meet demands for signal transmission and power supply

• Transmission characteristics simulation and measurement technologies to assure signal integrity in high-frequency transmissions.
• Power/ground simulation and measurement technologies to provide stable power supply
• EMI-simulation and near-electromagnetic-field measurement technology to suppress radiation noise

Simulation Software and Measurement Equipment

Thermal/Mechanical Simulation Software

Thermal/Mechanical Measurement Equipment

Electrical Simulation Software

Electrical Characteristics Measurement Equipment