Carbon Nanotube Thermal Interface Material
(under development)

Introduction

Heat generation in IC chips has increased with advancements in electronic device performance. Therefore, it is important and necessary to design a semiconductor package and module that takes heat dissipation into consideration. In addition, thermal interface material (TIM) requires high-thermal conductance, high-temperature resistance, and higher thermal stress relaxation performance.
SHINKO developed a carbon nanotube (CNT) TIM which utilizes the high thermal conductivity and flexibility of CNT to solve these problems with technology under license from Fujitsu Limited.

Features

• Form factor: Sheet type for customizable sizes
• Main specifications
  • Sheet dimensions: Maximum 50 x 50 mm
  • Sheet thickness: 0.1–0.15 mm

Structure

CNT-TIM is a uniquely structured with high thermal conductivity and flexibility. Grown on an axial direction keeping a vertical CNT array of which both edges are laminated with protective film and adhesive resin.

Applications

• Power semiconductor modules for automotive and industrial applications
• CPU/GPU for personal computers and servers
• Solutions for thermal management in electronic devices

Technical Document (Download)

Click on download the PDF file and view details.