IC Assemblies

PoP(Package on Package)

PoP(Package on Package)

p_si03.jpg

Concept

  • Stackable package structure

Features

  • Different package combinations are available by stackable package structure
  • High assembly yield by using known good packages
  • Smaller area after mounting on the board
  • Thinner chip using flip chip technology achieve fine pitch intermediate connection
  • Top and bottom package assembly technology

Structure

F_SI02.jpg

Application

  • Low Power Memory / ASIC
  • Logic + Memory
  • Logic + Logic

Related Information