Under Development

POL(Power Overlay)

POL(Power Overlay)

pol.jpg

Concept

  • Advanced embedded packaging solution for power electronics

Features

  • Active and passive components through a polyimide film to form a re-wiring directly connected with copper vias
  • Dedicated die attach material for power devices and passive components
  • Designed lower resistance, lower inductance and higher withstand voltage
  • Excellent heat dissipation
  • Double-sided cooling possible

Structure

F_PO01-100.jpg

POL_01.jpg

Related Information