Lidded Flip-Chip Package

Introduction

SHINKO provides a high-heat-dissipation flip-chip package that radiates heat to a heat spreader (lid) from the back side of an IC chip through the TIM (Thermal Interface Material).

Features

With the back side of the chip exposed from the mold resin, heat generated from the IC chip is dissipated directly to the lid
High quality and low price are realized by adopting an in-house leadframe as the lid
Various types of flip-chip bonding technology with high density IC chips are available
A molded exposed die structure under the lid enables low package warpage with a thin substrate.
4 to 6 layers substrates with 200 μm thickness core suitable for this package
Has been applied up to AEC-Q100 grade 2 capable automotive devices