IC Assemblies

High Heat Dissipation and High Density Flip Chip Package

High Heat Dissipation and High Density Flip Chip Package

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Features

  • Low profile and low warpage achieved with thin substrate, IC, and mold
  • Good heat dissipation by mounting lid directly on the backside of IC
  • Flip chip connection suitable for high pin-count, high-density bump pitch
  • Good cost performance from high manufacturing productivity
  • AEC-Q100 Grade2 compatible

Structure

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Application

  • Automotive infotainment processor
  • Image processing processor

Scope

  • Outline dimensions 23mm or less (mass production)

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