Pre-Plated Leadframe

Introduction

SHINKO provides the Pre-Plated leadframe for reduction of lead-time by eliminating external solder plating process in IC assembly.
SHINKO’s Pre-Plated leadframe is three-layers, Nickel-Palladium-Gold (Ni/Pd/Au), plating on entire leadframe surfaces for providing good interconnection between the IC chip and inner-leads of the leadframe, also outer-leads of the leadframe and Printed Circuit Board (PCB). In addition, stable package reliability is ensured.

Features

• No solder-plating process necessary
• Preventing solder bridge, in case of fine pitch leadframes
• Improved migration resistance

Structure

• Leadframe with improving thermal resistance due to Ni/Pd/Au plating on the copper material