IC Packages/IC Lead Frames

Build-up Substrate

DLL3®(Coreless Substrate)

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Concept

  • Applied DLL® technology
  • High wiring density and high performance IC package
  • Available thinner structure

Features

  • Produced by Direct Laser & Lamination (DLL®)process
  • CO2 laser is used for blind micro via forming
  • Semi-additive process is applied for Build-up layer
  • Enhanced electrical performance and high design flexibility due to no core layer
  • Applied green materials
  • Total package support including substrate design and manufacturing

Structure

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Application

  • In devices such as MPUs and ASICs for where high-density routing is required
  • In devices where a thinner structure is required

DLL3®Process advantages

  • Fine Pitch C4 Bump due to embeded FC pads in build up layer
  • Applied DLL® processes
  • Excellent for solder volume control on C4 pad

Technology Roadmap

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*DLL3 is a registered trademark of SHINKO ELECTRIC INDUSTRIES CO., LTD.

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