SHINKO to Exhibit and Speech at 2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025)

Invitation to our exhibit and speech on ICEP-IAAC 2025

2025 International Conference on Electronics Packaging joined with iMAPS All Asia Conference (ICEP-IAAC 2025) will be held from April 15 to 18 at Wakasato Municipal Cultural Hall, Japan.
SHINKO will introduce Optical Chiplet/Co-Packaged Optics, high-density organic substrate i-THOP® (integrated-Thin film High density Organic Package) , POL (Power Overlay) for power semiconductor, and advanced packaging technologies.
We are looking forward to seeing you at the conference.