SHINKO to Exhibit at the 2026 IEEE 76th Electronic Components and Technology Conference（ECTC2026）

2026.05.22

Invitation to our booth on ECTC2026

The 2026 IEEE 76th Electronic Components and Technology Conference（ECTC2026）will be held from May 26 to 29, at the Grande Lakes Resort, Orlando, Florida, USA.
SHINKO America will exhibit our large-size multi-layered advanced packaging, Optical Chiplet/Co-Packaged Optics (CPO), and glass core substrate technologies.
We are looking forward to seeing you at our booth.

Date	May 25 (Tue) - 29 (Thu), 2026 Our booth will be open : May 27 (Wed) and May 28 (Thu)
Venue	The Grande Lakes Resort, Orlando, Florida, USA
Organizer	IEEE Electronics Packaging Society (EPS)
Official Website	https://ectc.net/