SHINKO to Exhibit at Advanced Packaging and Chiplet Summit (APCS) 2026, co-located with SEMICON JAPAN 2026
2026.11.10
Invitation to our booth on APCS2026
The Advanced Packaging and Chiplet Summit (APCS) 2026, co-located with SEMICON JAPAN 2026, will be held from December 9 to 11, 2026 at Tokyo Big Sight, Japan.
SHINKO will exhibit our Advanced Packaging and Chiplet technologies.
We are looking forward to seeing you at our booth.
| Date | December 9 (Wed) – 11 (Fri), 2026 Opening Hours 10:00-17:00 |
|---|---|
| Venue | Tokyo Big Sight in Tokyo, Japan |
| Organized | SEMI Japan |
| Official Website | https://www.semiconjapan.org/en/apcs |
| Booth Number | W1374 at West Hall 1 (APCS Promenade) |