SHINKO to Speech at 2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026)

Invitation to our speech on ICEP-HBS 2026

2026 International Conference on Electronics Packaging joined with Hybrid Bonding Symposium (ICEP-HBS 2026) will be held from April 14 to 18 at International Conference Center Hiroshima, Japan.
SHINKO will introduce Optical Chiplet/Co-Packaged Optics*, high-density organic substrate i-THOP® (integrated-Thin film High density Organic Package) , glass core substrate.
We are looking forward to seeing you at the conference.
*This work was based on results obtained from a project, JPNP20017, subsidized by the New Energy and Industrial Technology Development Organization (NEDO).