SHINKO to Exhibit at the 22nd Device Packaging Conference 2026 (DPC2026)
2026.02.16
Invitation to our booth on DPC2026
The 22nd Device Packaging Conference 2026 (DPC2026) will be held from March 2 to 5, 2026 at Sheraton Grand at Wild Horse Pass, Phoenix, Arizona, USA.
SHINKO America will exhibit our advanced packaging and chiplet technologies.
We are looking forward to seeing you at our booth.
| Date | March 2 (Mon) - 5 (Thu), 2026 Our booth will be open : March 3 (Tue) and March 4 (Wed) |
|---|---|
| Venue | Sheraton Grand at Wild Horse Pass in Phoenix, Arizona, USA |
| Organizer | IMAPS (International Microelectronics Assembly and Packaging Society) |
| Official Website | https://imaps.org/page/device-packaging-conference |