SHINKO to Speech at International Symposium on Advanced Power Packaging（ISAPP 2025）

Invitation to our speech on ISAPP 2025

International Symposium on Advanced Power Packaging（ISAPP 2025）will be held from November 5 to 7 at Fukuoka International Congress Center, Japan.
SHINKO will present a paper on POL(Power Overlay) for power semiconductor, and advanced packaging technologies.
We are looking forward to seeing you at the conference.