Introduction
A heat spreader is high thermal conductive metallic materials for efficient heat dissipation from an IC chip in a semiconductor package.
SHINKO is trying to develop and commercialize various types of heat spreaders by using excellent stamping and surface finish treatment technologies. These spreaders are used in CPUs for desktop personal computers and servers.
Features
- Mass-production technology for Transfer stamping
- Products with more complicated shapes can be produced by combining stamping and machining
- Consistent process from stamping die tool design and manufacturing, heat spreader stamping and machining to surface treatment
- Advanced surface treatment for superior corrosion resistance and ease for package assembly
- Specifications
- Material: Cu (C1020, C1100)
- Surface treatment: Electrolytic Ni plating or Electrolytic Ni and selective Au plating
- Heat spreader size: Outer length 10~100 mm, Thickness 1.0–4.5mm
Applications
- CPU packages for personal computers
- CPU packages for servers
- SoC/FPGA packages for automotive devices
- Processor packages for communication equipment
- AI processor packages
Technical Document (Download)
Click on download the PDF file and view details.
