Company Profile

Technology & Products

Based on a Variety of Leading-Edge Technologies

SHINKO has always met the demands of the mainstay semiconductor package market in a timely manner. At the same time, we have accumulated proprietary technologies and extended our product lineup to meet diversifying market needs. As a consequence, we now have a wide range of products for semiconductor packaging incomposing core technologies.
Although many dedicated manufacturers specialize in specific product fields or technologies, SHINKO covers the entire semiconductor packaging area and is unparalleled in the world.
This original corporate feature has become a real strength in exerting our competitive edge in the global market.

Sophisticated Core Technology as a Strength to Meet Emerging Needs

Starting from the business of recycling home-use light bulbs, SHINKO later entered into the semiconductor peripheral field with the manufacture of glass-to-metal seals for transistors. Since then, "Technology Development" for developing and accumulating new technologies has been a management priority.
Our core technologies, which consist of eight core technologies, have been nurtured throughout our history (see attached table). Each has been developed through corporate research with an insight toward future business. We intend to further satisfy diversifying customer needs by elaborating on these technologies.
Laminate technology developed through ceramic packaging, for example, is essential even though the base material preferred by the market has changed from ceramics to plastics. Plating technology, which has long been used from the epoch of glass-to-metal seals for transistors, still applies to the latest MPU packaging.
We continue to address current needs through the applied combination of our diversified core technologies.

Supply of Total Solutions for Semiconductor Packaging

Based on the "Interconnecting Technology" to electrically connect IC chips to PCBs, SHINKO has contributed much to the development of electronic equipment by supplying innovative products and services that meet diverse market needs.
In package products, for example, we have realized a wide product lineup with the latest buildup of PCB models and lead frames that boast high cost performance due to mass production. In addition, we can handle diverse post-processes for semiconductor production from design to mass production via the supply of packaging services (assembly) for the mounting, electrical connection and assembly of IC chips by exerting our leading-edge interconnect technology. Our advanced technologies effectively facilitate the speedy commercialization of semiconductor products at our clients.
Furthermore, we support both the upstream and downstream peripheral fields of semiconductor packaging through the supply of module and component products by applying accumulated core technologies to new uses.

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