SHINKO ELECTRIC INDUSTRIES CO., LTD.
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To Our Shareholders
Semiconductor packages perform a variety of tasks, such as providing a power supply to IC chips, transmitting signals emitted by IC chips to other devices, and offering protection from the outside environment. IC chips cannot function on their own, but the support of semiconductor packages helps to maximize capabilities of IC chips.
Through connecting IC chips with the exterior, power can be supplied and electrical signals can be both input and output.
Semiconductor packages protect extremely fine circuits formed on IC chips from impact, dust, moisture, and other threats posed by the outside environment.
Packages also disperse heat generated while the IC chip is operating. (In addition to semiconductor packages, our heat spreaders also function as heat dispersers.)
Due to the extremely fine circuits formed on IC chips, semiconductor packages transform the IC chip with a shape that can be connected to the exterior by packaging the IC chip.
Multiple IC chips with various functions can be installed on a single semiconductor package, enabling the creation of high-performance devices.