SHINKO to Exhibit at Advanced Packaging and Chiplet Summit (APCS) 2024, co-located with SEMICON JAPAN 2024
2024.11.11
Invitation to our booth on APCS 2024
The Advanced Packaging and Chiplet Summit (APCS) 2024, co-located with SEMICON JAPAN 2024, will be held from December 11 to 13, 2024 at Tokyo Big Sight, Japan.
SHINKO will exhibit our advanced packaging and chiplet technologies.
We are looking forward to seeing you at our booth.
| Date & Time | December 11 (Wed) - 13 (Fri), 2024 Opning Hours 10:00 - 17:00 |
|---|---|
| Venue | Tokyo Big Sight (East Hall) in Tokyo, Japan |
| Organizer | SEMI Japan |
| Official Website | |
| Booth Number | 2255 at East Hall 2 (APCS Promenade) |