SHINKO to Speech at the 27th IEEE Electronics Packaging Technology Conference (EPTC 2025)

Invitation to our speech on EPTC 2025

The 27th IEEE Electronics Packaging Technology Conference (EPTC 2025) will be held from December 2 to 5 at Resorts World Sentosa, Singapore.
SHINKO will present a paper on 150 GHz AiP Stacked Module Structural Analysis. This work was supported in part by the Ministry of Internal Affairs and Communications, Japan, under Grant JPJ000254.
We are looking forward to seeing you at the conference.