SHINKO to Exhibit at Advanced Packaging and Chiplet Summit (APCS) 2025, co-located with SEMICON JAPAN 2025
2025.11.12
Invitation to our booth on APCS 2025
The Advanced Packaging and Chiplet Summit (APCS) 2025, co-located with SEMICON JAPAN 2025, will be held from December 17 to 19, 2025 at Tokyo Big Sight, Japan.
SHINKO will exhibit our advanced packaging and chiplet technologies.
We are looking forward to seeing you at our booth.
| Date & Time | December 17 (Wed) - 19 (Fri), 2025 Opening Hours 10:00 - 17:00 |
|---|---|
| Venue | Tokyo Big Sight East Hall in Tokyo, Japan |
| Organizer | SEMI Japan |
| Official Website | |
| Booth Number | E6151 at East Hall 6 (APCS Promenade) |