SHINKO to Exhibit at Advanced Packaging and Chiplet Summit (APCS) 2023, co-located with SEMICON JAPAN 2023
2023.11.06
Invitation to our booth on APCS 2023
The Advanced Packaging and Chiplet Summit (APCS) 2023, co-located with SEMICON JAPAN 2023, will be held from December 13 to 15, 2023 at Tokyo Big Sight, Japan.
SHINKO will exhibit our advanced packaging and chiplet technologies.
We are looking forward to seeing you at our booth.
| Date & Time | December 13 (Wed) - 15 (Fri), 2023 Opning Hours 10:00 - 17:00 |
|---|---|
| Venue | Tokyo Big Sight (East Hall) in Tokyo, Japan |
| Organizer | SEMI Japan |
| Official Website | |
| Booth Number | APCS : 2853 at East Hall 2 |