Research & Development

Simulation Technology

Numerical Simulation Technology

SHINKO extensively applies various numerical simulation technologies to facilitate research, development, reliability evaluation, and production technology improvement of variety of packages and substrates.
SHINKO’s expertise in simulation technology encompasses signal and power integrity of high-speed transmission lines, thermal stress calculation, warpage prediction, and reliability estimation that are indispensable to produce high-performance semiconductor packages.
SHINKO’s customers will find the optimal solutions through cooperative work extended by our simulation team.

Thermal & Mechanical Simulations

Category Physical Characteristic Software Used
Thermal Simulation Thermal resistance
Fluid flow
ABAQUS  
FloTHERM  
CFX
Mechanical Simulation Thermal stress
Warpage
Solder fatigue
Plastic forming
ABAQUS
ANSYS/LS-DYNA

Electrical Simulations

Category Physical Characteristic Software Used
Signal Integrity S-Parameters
Eye pattern
BER
ANSYS HFSS
ANSYS Q3D
ANSYS Designer  
Power Integrity PDN impedance Cadence PowerSI
EMI Radiation noise ANSYS HFSS
Cadence PowerSI
Cadence S2K

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