Multi-layer Thin Film Technology

Features

• Fine trace: Formation of Line / Space = 2 um / 2 um wiring by photolithography + fine trace plating.
• Small via: Formation of interlayer connection via of 10 um diameter / 5 um thickness by photo via + fill plating.
• High Accuracy: High dimensional and positional accuracy.
• High Reliability: For insulation and thermal cycle resistance.

Further Miniaturization (under development)