- Advanced Technologies
- Multi-layer Thin Film Technology
Research & Development
Multi-layer Thin Film Technology
- Fine trace: Formation of Line / Space = 2 um / 2 um wiring by photolithography + fine trace plating.
- Small via: Formation of interlayer connection via of 10 um diameter / 5 um thickness by photo via + fill plating.
- High Accuracy: High dimensional and positional accuracy.
- High Reliability: For insulation and thermal cycle resistance.
Further Miniaturization (under development)