Research & Development

Advanced Technologies

Multi-layer Thin Film Technology

Features

  • Fine trace: Formation of Line / Space = 2 um / 2 um wiring by photolithography + fine trace plating.
  • Small via: Formation of interlayer connection via of 10 um diameter / 5 um thickness by photo via + fill plating.
  • High Accuracy: High dimensional and positional accuracy.
  • High Reliability: For insulation and thermal cycle resistance.

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Further Miniaturization (under development)

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Related Information