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  3. Research and Development

Research and Development

Features of Research and Development

Introducing SHINKO’s research and development into the unique advanced technologies that are leading the industry.

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State-of-the-Art Technology

Introduction of advanced technology developments in SHINKO R&D for supporting our products.

Patterning Technology

SHINKO is developing fine patterning and high integration technology for substrates for semiconductor package.

Copper Wiring Formation Technology Using Dry Process
Research and Development

Interconnect and Assembly Technology

SHINKO is developing interconnect technologies for fine-pitch IC Chips.

Assembly Technology for Supporting Next-Generation Computing Fine Pitch Flip-Chip Bump Technology
Research and Development

Plating Technology

The plating technology is widely used in our products. SHINKO is continually evolving this technology.

New Copper Plating Technology