Research & Development

Core Technologies

New Electrolytic Cu Plating Technology

Concept

We have developed new electroplating technology that maximize performance of electroplating solution.

Features

  • Electroplating that achieves via filling with high aspect ratio without void.
  • High speed copper plating for via filling that takes only 11 minutes.

70e7b16a939354c5bd1d24d536c0a6db7ddde2a3.jpg

Related information