Research & Development

Core Technologies

Cu Trace Formation Technology by SAP using Dry Process

Concept

Compared to the conventional Cu trace structure by electroless Cu plating on the rough resin surface, a high-quality Cu trace structure by dry process has been achieved on smooth surface without undercut.

Features

  • Fine Cu traces using semi-additive process (SAP).
  • Advanced dry processes such as plasma etching and sputtering used in conventional semiconductor technologies.

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