SHINKO ELECTRIC INDUSTRIES CO., LTD.
We made full use of semiconductor packaging technologies to steadily expand the business fields.
It was in this era that our business expanded overseas rapidly.
Began manufacturing
glass-to-metal seals for laser diodes.
Began manufacturing ceramic PGA
(Pin Grid Array) packages.
Began assembling
cerdip ICs.
Opened the Takaoka Plant in Nakano-City,
Nagano Prefecture.
Opened the Arai Plant in Arai-City
(now Myoko-City), Niigata Prefecture.
Established SHINKO ELECTRIC AMERICA, INC.
in the US state of California.
The 30th anniversary of the establishment.
Began manufacturing precision
contact parts and
ceramic surge arrestors.
Began manufacturing microlamps.
Developed continuous plating equipment.
Established an export department with the start of
full-scale export operations.
Began manufacturing multilayered ceramic packages.
Began manufacturing the "DIP-17" IC leadframe.
Began manufacturing
cerdip leadframes.
The 20th anniversary of the establishment.
Began manufacturing DIP-10 packages,
marking the start of IC package production by the Company.
