SHINKO to Exhibit at the 21st Annual Device Packaging Conference (DPC2025)
2025.02.28
Invitation to our booth on DPC2025
The 21st Annual Device Packaging Conference (DPC2025) will be held from March 3 to 6, 2025 at Sheraton Grand at Wild Horse Pass, Phoenix, Arizona, USA.
SHINKO America will exhibit our advanced packaging and chiplet technologies.
We are looking forward to seeing you at our booth.
| Date | March 3 (Mon) - 6 (Thu), 2025 Our booth will be open : March 4(Tue) and March 5(Wed) |
|---|---|
| Venue | Sheraton Grand at Wild Horse Pass in Phoenix, Arizona, USA |
| Organizer | IMAPS (International Microelectronics Assembly and Packaging Society) |
| Official Website | https://imaps.org/page/IMAPSDevicePackaging2025 |